Vibrating device for positioning a miniaturized piece in a testing accommodation, and positioning method

ABSTRACT

A for positioning a miniaturized piece includes a positioning structure that forms a first cavity designed to receive with play the miniaturized piece and a second cavity communicating with the first cavity. At least one electrical-contact terminal is provided facing the second cavity and is electrically coupleable to an electronic testing device designed to carry out an electrical test on the miniaturized piece. An actuator device causes a vibration of the positioning structure such that the vibration translates the miniaturized piece towards the second cavity until it penetrates at least in part into the second cavity.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application from U.S. applicationSer. No. 14/258,911 filed Apr. 22, 2014, which claims priority toItalian Patent Application No. TO2013A000324, filed Apr. 22, 2013, thedisclosures of which are incorporated herein by reference in theirentireties.

SUMMARY

An embodiment relates to a vibrating device for positioning aminiaturized piece in a desired accommodation, and in particular in atesting accommodation. Furthermore, an embodiment relates to a methodfor positioning a miniaturized piece.

As is known, there are today available devices for positioningminiaturized pieces. In particular, there are known devices forpositioning integrated electronic circuits (chips), which are designedto receive integrated circuits from machinery of the so-called“pick-and-place” type, and to position these integrated circuits intesting positions, i.e., in positions in which the integrated circuitsare electrically coupled to testing machinery.

By way of example, patent No. JP 58 084311, which is incorporated byreference, describes a positioning device includingcontrolled-displacement fluidic means, which can be activated so as toexert a pneumatic force on a piece to be moved, this pneumatic forcebeing designed to push the piece into a desired position.

Thanks to the use of pneumatic forces, the positioning device describedin the patent No. JP 58 084311 is particularly suitable for positioningpieces having appreciable dimensions. However, precisely on account ofthe use of pneumatic forces, this positioning device could prove farfrom suitable for positioning very precisely pieces having verycontained dimensions, such as, for example, integrated circuits.

An embodiment is a positioning device that overcomes the drawbacks ofthe known art, at least in part.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the concepts disclosed herein, embodimentsare now described, purely by way of non-limiting examples, withreference to the following drawings.

FIG. 1 shows a block diagram of a positioning device, according to anembodiment.

FIG. 2 is a schematic cross-sectional view of a portion of thepositioning device of FIG. 1 and of testing machinery, according to anembodiment.

FIGS. 3, 7, and 8 show perspective views of portions of embodiments of apositioning device.

FIGS. 4a and 4b show perspective views of an integrated circuit and of aportion of the embodiment illustrated in FIG. 3, at two differentinstants in time.

FIGS. 5 and 6 show, respectively, the time plots of the speed and of theacceleration to which a portion of a positioning device is subjected,according to an embodiment; and

FIG. 9 is a schematic top plan view of a portion of an embodiment of apositioning device.

DETAILED DESCRIPTION

FIGS. 1 and 2 show a positioning device 1, which is designed to beelectrically coupled to a testing device 2, which is also known as a“tester” 2.

In detail, the positioning device 1 includes a socket board 4 and asocket 6, which are fixed with respect to one another. Furthermore, thepositioning device 1 includes a fixed frame 8.

The socket board 4 is mechanically coupled to the fixed frame 8 in sucha way as to be able to slide with respect to the latter, in a directionof vibration D. For this purpose, present in the embodiment illustratedin FIGS. 1 and 2 is a plurality of bearings 10, which are preciselydesigned to enable movement of the socket board 4, and hence also of thesocket 6 fixed thereto, with respect to the fixed frame 8, in bothdirections of the dimension of vibration D. In other words, the bearings10 form a so-called “linear guide”.

The socket 6 forms a plurality of positioning sites 20, each of whichcan house a corresponding miniaturized piece 22, of a type in itselfknown. In the following of the present description, it is assumed,without this implying any loss of generality, that the miniaturizedpieces 22 are formed by corresponding integrated electronic circuits.

As is shown purely by way of example in FIG. 1, the positioning sites 20are the same as one another and are arranged so as to form a planararray; i.e., they are arranged in rows and columns, the rows beingarranged, for example, parallel to the dimension of vibration D.

As is shown in greater detail in FIG. 3, each positioning site 20includes a respective positioning structure 25, which delimits a firstcavity 30 and a second cavity 32 that communicate with one another.

The first cavity 30 and the second cavity 32 are delimited at thebottom, respectively, by a first bottom surface 34 and a second bottomsurface 38, which are formed by the positioning structure 25, areplanar, are coplanar, and are designed to carry a miniaturized piece 22.

The first and second bottom surfaces 34 and 38 form a single piece andlie in a plane parallel to the dimension of vibration D. Furthermore,the first bottom surface 34 has the shape of a trapezium, the corners ofwhich at the two vertices corresponding to the major base are chamfered;the minor base, instead, is coupled to the second bottom surface 38,which has the shape of a rectangle or a square. In particular, the sideof the second bottom surface 38 that is coupled to the first bottomsurface 34 is as long as the aforementioned minor base.

Given a vertical axis H, perpendicular to the first and second bottomsurfaces 34 and 38, the first cavity 30 is open at the top and isdelimited laterally by a first bottom lateral surface 36 and by a firsttop lateral surface 37, which are formed by the positioning structure25.

The first bottom lateral surface 36 extends parallel to the verticalaxis H with a height 1, starting from the perimeter of the first bottomsurface 34.

Consequently, the first bottom lateral surface 36 forms a sort of guide,which converges, i.e., decreases its own width, in a direction of thesecond cavity 32, until it has the same width as the second bottomsurface 38, the widths being measured along an axis perpendicular to thevertical axis H and to the dimension of vibration D (the width ismeasured from one side of the bottom of the cavity 30 to the other sideof the bottom of the cavity along an axis perpendicular to the axis Hand the dimension D).

The first top lateral surface 37 extends above the first bottom lateralsurface 36, to which it is coupled. Moreover, the first top lateralsurface 37 is inclined with respect to the vertical axis H so as toassume a flared shape. In particular, assuming that the vertical axis Hpasses through the centroid of the first bottom surface 34 and isoriented from beneath upwards, i.e., it is set in such a way that thefirst top lateral surface 37 is arranged above the first bottom lateralsurface 36, the first top lateral surface 37 is curved and defines ashape tapered towards the first bottom surface 34. In other words, givenany secant plane perpendicular to the first bottom surface 34 andcontaining the vertical axis H, the distance from the vertical axis H toeach point of the line of intersection present between the first toplateral surface 37 and the secant plane is proportional to the height ofthe point itself

More in particular, the first top lateral surface 37 includes a firstportion 39 a and a second portion 39 b, which are arranged specular toone another. Furthermore, each of them is inclined by an angle α withrespect to a corresponding portion of the underlying first bottomlateral surface 36, the angle α being non-zero. Each portion 39 a and 39b of the surface 37 is hence inclined with respect to the first bottomsurface 34 by an angle β=90°−α, at the most equal to 45°.

The second cavity 32 is delimited laterally by a second bottom lateralsurface 40 and by a second top lateral surface 42; moreover, the secondcavity 32 is delimited at the top by a covering surface 44, which iscoupled to the second top lateral surface 42. Also the second bottomlateral surface 40, the second top lateral surface 42, and the coveringsurface 44 are formed by the positioning structure 25.

The second bottom lateral surface 40 extends parallel to the verticalaxis H with a height equal to 1, starting from the perimeter of thesecond bottom surface 38. The second top lateral surface 42 extendsabove the second bottom lateral surface 40, to which it is coupled.Furthermore, the second top lateral surface 42 includes a first portion43 a (illustrated in FIG. 4a ) and a second portion 43 b, which areparallel to the dimension of vibration D and are inclined with respectto the vertical axis H by an angle equal to the angle α. Furthermore,the second top lateral surface 42 has a third portion 43 c (illustratedin FIG. 4a ), which forms, together with an underlying portion of thesecond bottom lateral surface 40, a back surface 45, which is arrangedin a direction perpendicular to the dimension of vibration D.

In greater detail, assuming that we are considering a miniaturized piece22 having, to a first approximation, the shape of a parallelepiped ofnegligible height and delimited at the top and at the bottom by a topmain surface S_(a) and a bottom main surface S_(b), each of which has anarea equal to A, the first bottom surface 34 has an area at least equalto 1.1*A. Consequently, the first cavity 30 is designed to receive theminiaturized piece 22 from, for example, a pick-and-place machine (notshown), and to house this miniaturized piece 22 with an appreciableplay. Furthermore, thanks to the inclination of the first top lateralsurface 37, in a case where the miniaturized piece 22 were not initiallyset by the pick-and-place machine in a precise way, i.e., the piece wereto contact part of the first top lateral surface 37, it wouldsubsequently slide on the bottom of the first cavity 30, with its ownbottom main surface S_(b) entirely in contact with the first bottomsurface 34, as illustrated in FIG. 3. Purely by way of example, shown inFIG. 3 is a miniaturized piece 22 having a height greater than theheight 1 of the first and second bottom lateral surfaces 36, 40;however, it is also possible for the height of the miniaturized piece 22to be less than the height 1.

The positioning device 1 further includes a plurality ofelectrical-contact terminals 46, which face the second bottom surface 38so that they can be contacted by the miniaturized piece 22, as describedhereinafter; the second cavity 32 hence defines an electrical-testingaccommodation. In this coupling, extending on the bottom main surfaceS_(b) of the miniaturized piece 22 is a plurality of conductive pads 47.

In use, the tester 2 is set underneath the fixed frame 8, which in turnis overlaid, in order, by the socket board 4 and by the socket 6.Furthermore, the electrical-contact terminals 46 are electricallycoupled to the tester 2 by means of corresponding electrical connections(not shown), which extend through the socket 6, the socket board 4, anda plurality of flexible connections 48 (FIG. 2) of a mechanical type.

As shown once again in FIG. 1, the positioning device 1 further includesa first actuator 50 and a second actuator 52, which are electricallycontrolled.

The first and second actuators 50 and 52 are of a piezoresistive type.Moreover, the first and second actuators 50 and 52 are fixed withrespect to the fixed frame 8 and are mechanically coupled to the socketboard 4 in such a way that by electrically controlling in a way initself known these first and second actuators 50 and 52, it is possibleto bring about vibration, with respect to the fixed frame 8, of thesocket board 4, and hence also of the socket 6, parallel to thedimension of vibration D.

More in particular, the positioning device 1 includes an electroniccontrol unit 60, which is designed to control the first and secondactuators 50 and 52 by generating corresponding electrical controlsignals in such a way as to cause oscillation of the socket board 4about a resting position.

Even more in particular, the electronic control unit 60 controls thefirst and second actuators 50 and 52 in such a way that the socket board4 will follow, in time, a non-symmetrical speed profile, as shown purelyby way of example in FIG. 5.

Before describing in detail the aforementioned non-symmetrical speedprofile, it is pointed out that the positioning sites 20 are oriented inspace all in the same way. It is hence possible to define a vibrationaxis VH (FIGS. 1 and 2) parallel to the dimension of vibration D,passing, for example, through the centroid of the socket 6 and orientedin such a way that, given any positioning site 20, it is parallel, andwith concordant sense, to a hypothetical vector, which connects thecentroids of the first and second bottom surfaces 34, 38 and is orientedfrom the centroid of the second bottom surface 38 to the centroid of thefirst bottom surface 34. In practice, given any positioning site 20, thevibration axis VH is parallel to an axis of symmetry of the surfaceformed by the set of the corresponding first and second bottom surfaces34, 38; moreover, the vibration axis VH is oriented towards thecorresponding first cavity 30.

In what follows, reference is made to vector quantities (velocities andaccelerations), implying the fact that they are oriented parallel to thedimension of vibration D. Furthermore, given a vector quantity, byconvention it is assumed that it has positive sense in the case whereits sense is concordant with the sense of the vibration axis VH.Consequently, it is assumed that this vector quantity has negative sensein the case where its sense is opposite to the sense of the vibrationaxis VH.

This being said, for each period of oscillation T_(O), during a firstperiod T₁ the socket board 4 is accelerated with an acceleration {rightarrow over (a)}₁, which is positive and constant. In particular, thesocket board 4 is accelerated starting from an initial instant in whichit has zero speed until it reaches a first maximum speed v_(max1).

During a second period T₂, the socket board 4 is kept at constant speed,this speed being equal, for example, precisely equal, to v_(max1).

Next, during a third period T₃ having a duration equal to the firstperiod T₁, the speed of the socket board 4 is decreased, until thesocket board 4 is brought into conditions of zero speed. For thispurpose, the socket board 4 is subjected to an acceleration {right arrowover (a)}₂, which is negative and has a modulus equal to the modulus ofthe acceleration {right arrow over (a)}₁.

Next, during a fourth period T₄, the socket board 4 is kept stationary.

Next, during a fifth period T₅, the socket board 4 is accelerated withan acceleration {right arrow over (a)}₃, which is negative and constant.In particular, the socket board 4 is accelerated until it reaches asecond maximum speed −v_(max2). Even more in particular, the modulus ofthe acceleration {right arrow over (a)}₃ is less than the modulus of theacceleration {right arrow over (a)}₁.

Next, during a sixth period T₆, the socket board 4 is kept at constantspeed, this speed being equal to, for example, precisely equal to,−v_(max2).

Next, during a seventh period T₇ having a duration equal to the fifthperiod T₅, the speed of the socket board 4 is decreased (in absolutevalue) until the socket board 4 is brought back into conditions of zerospeed. For this purpose, the socket board 4 is subjected to anacceleration {right arrow over (a)}₄, which is positive and has amodulus equal to the modulus of the acceleration {right arrow over(a)}₃.

The speed profile followed by the socket board 4 during each period ofoscillation A is such that the time integral of the speed profile itselfis zero. In this way, as mentioned previously, the socket board 4, andconsequently also the socket 6, vibrates about a resting position.Furthermore, since with reference to a given positioning site 20 thespeed profile to which the respective positioning structure 25 issubjected is the same profile to which the socket board 4 is subjected,also the positioning structure 25 vibrates about a respective restingposition. During this vibration, the respective first and secondcavities 30 and 32 move fixedly with respect to one another.

In greater detail, each positioning structure 25 is subjected to anacceleration profile, an example of which is illustrated in FIG. 6. Theacceleration profile is such that, basically throughout the timeinterval formed by the first, second, and third periods T₁, T₂, T₃,there is, on the hypothesis that the miniaturized piece 22 has been setin the first cavity 30, a relative motion of the miniaturized piece 22with respect to the first bottom surface 34. In particular, in areference system fixed with respect to the positioning structure 25, theminiaturized piece 22 moves with a sense opposite to the sense of thevibration axis VH; i.e., it moves in the direction of the second cavity32. This is due to the fact that the acceleration {right arrow over(a)}₁ is such that the miniaturized piece 22 is subjected to a forcegreater, in modulus, than the force of static sliding friction to whichthe miniaturized piece 22 is subjected, which depends, as is known, uponthe mass of the miniaturized piece 22, upon the materials that form theminiaturized piece 22 and the first bottom surface 34, as well as uponthe roughness of the surfaces of the miniaturized piece 22 and of thefirst bottom surface 34 that are in contact with one another.Translation of the miniaturized piece 22 towards the second cavity 32 ishence due to the fact that, during the aforementioned time interval, theforces of friction present between the miniaturized piece 22 and thefirst bottom surface 34 are not sufficient to cause the miniaturizedpiece 22 to move fixedly with the first bottom surface 34.

The acceleration profile is moreover such that, throughout the timeinterval formed by the fourth, fifth, sixth, and seventh periods T₄, T₅,T₆, T₇, little or no relative motion of the miniaturized piece 22 withrespect to the first bottom surface 34 occurs; at least the relativemotion of the piece 22 is less, in magnitude, during this time intervalas compared to the previous time interval.

Following upon the succession of periods of oscillation T_(O), theminiaturized piece 22 hence tends to move in the direction of the secondcavity 32. In particular, the converging guide formed by the firstbottom lateral surface 36 causes the miniaturized piece 22 to penetrategradually into the second cavity 32, setting itself so as to overlie thesecond bottom surface 38, and hence also the electrical-contactterminals 46, as illustrated in FIG. 4b . In practice, the miniaturizedpiece 22 translates, as a result of the vibrations of the positioningstructure 25 until it comes into contact with the side/end surface 45.

Unlike the first cavity 30, the second cavity 32 is not accessible tothe pick-and-place machine and is calibrated according to the shape ofthe miniaturized piece 22; i.e., it is sized so as to receive theminiaturized piece 22 with little or no play. In other words, the widthof the second bottom surface 38 is substantially equal to the width ofthe bottom main surface S_(b) of the miniaturized piece 22, but for thetolerance associated to the latter width, so as to enable entry of theminiaturized piece 22 into the second cavity 32. For instance, theminiaturized piece 22 can have a tolerance as regards its width equal toone tenth of a millimeter.

The third portion 43 c of the second top lateral surface 42 has aplurality of side/end holes 72 of a through type. In addition, asillustrated in FIG. 7, the positioning device 1 includes a pneumaticpump 74, which is mechanically coupled to the holes 72 by means of apneumatic connection 76 (represented symbolically).

In use, the pneumatic pump 74 is designed to keep the miniaturized piece22 stationary in contact with the bottom surface 45 in order to enablesubsequent execution of the test by the tester 2. In practice, thepneumatic pump 74 is designed to cause the miniaturized piece 22, aftercontacting the bottom surface 45, to remain in contact with the bottomsurface 45, i.e., to maintain a testing position, where the conductivepads 47 of the miniaturized piece 22 contact corresponding electricalcontact terminals 46. In these conditions, the miniaturized piece 22 isin electrical contact with the tester 2, which can hence carry out anelectrical test on the miniaturized piece 22 in a way in itself known.

In detail, the pneumatic pump 74 generates a suction force that keepsthe miniaturized piece 22 in contact with the bottom surface 45 thanksto the creation of a negative pressure in an area corresponding to thebottom surface 45 itself. This suction force has a limited modulus sinceit is not required to perform the task of moving the miniaturized piece22 from the first cavity 30 to the second cavity 32. The suction forceis limited, in fact, to keeping the miniaturized piece 22 substantiallystationary after it has reached the testing position, following upon thevibrational movements of the positioning structure 25, preventing theminiaturized piece 22 from bouncing on account of the impact against theside/end surface 45. In other words, the suction force just keeps theminiaturized piece 22 in the testing position. Possible effects ofsticking between the surface 45 and the miniaturized piece 22 alsocontribute to keeping the latter in the testing position.

The modulus of the suction force may hence be less than the modulus thatwould be necessary in the case where this suction force were to overcomethe static sliding friction between the miniaturized piece 22 and thebottom surfaces of the positioning structure 25.

The pneumatic pump 74 can moreover be used for generating a flow of gasthat passes through the holes 72, which is such as to move theminiaturized piece 22 away from the side/end surface 45, after the testhas terminated.

In order to enable proper timing of the operations performed by thepositioning device 1, the latter further includes, for each secondcavity 32, a corresponding sensor 62, which is a so-called vacuum sensorof a type in itself known (for example, of an electro-optical or elsepneumatic type), which is designed to generate an electrical vacuumsignal, indicating whether a miniaturized piece is or is not in contactwith the corresponding side/end surface 45.

The electronic control unit 60 is moreover coupled to the sensors 62 andto the pneumatic pumps 74 and controls operation thereof. In particular,after the pick-and-place machine has set the miniaturized pieces 22 inthe corresponding first cavities 30, the electronic control unitactuates the pneumatic pumps 74 in such a way that they will generatenegative pressures in an area corresponding to the end surfaces 45 ofthe positioning sites 25.

Next, the electronic control unit 60 controls the first and secondactuators 50 and 52 so as to generate the vibration. This leads totranslation of the miniaturized pieces. Furthermore, even though inpractice the miniaturized pieces 22 reach the respective end surfaces 45at different instants in time, the use of the pneumatic pumps 74 enablesonset, at a given instant in time, of a situation in which all theminiaturized pieces 22 are set in the respective testing positions. Thissituation is detected by the electronic control unit 60 on the basis ofthe electrical vacuum signals generated by the sensors 62. In practice,as a whole the sensors 62 form a position sensor designed to supply asignal indicating that the corresponding testing positions have beenreached by all the miniaturized pieces 22.

Following the detection of all the miniaturized pieces 22 having reachedthe testing positions, the electronic control unit 60 controls the firstand second actuators 50 and 52 so as to stop the vibration.

Next, the electronic control unit 60 switches the pneumatic pumps 74off, and the tester 2 carries out testing of the miniaturized pieces 22.

Finally, the electronic control unit 60 controls the pneumatic pumps 74in such a way that they generate flows of gas that push the miniaturizedpieces 22 again into the first cavities 30, where they can be handled bythe pick-and-place machine.

It is noted that, even though in the embodiments shown so far thecovering surface 44 of each positioning site 20 is planar and closes theentire second cavity 32 underlying it at the top, there are, however,possible embodiments in which the covering surface 44 is hollow, i.e.,it forms a top hole 77, of a through type. An example of suchembodiments is illustrated in FIG. 8. In this case, the positioningdevice 1 further includes a plate 78 and a third actuator 79, forexample of a mechanical type, which is controlled by the electroniccontrol unit 60 and is designed to move the plate 78 in such a way that,passing through the top hole 77, the plate 78 exerts a pressure on thetop main surface S_(a) of the miniaturized piece 22. In this way, theplate 78 presses the miniaturized piece 22 against the second bottomsurface 38, substantially guaranteeing electrical contact between theconductive pads 47 and the electrical contact terminals 46.

As illustrated in FIG. 9, the positioning device 1 may moreover include,for each column of positioning sites 20, an optical source 80 and anoptical detector 82, which are fixed with respect to the socket 6. Theoptical source 80 is designed to emit an optical beam OB. In this case,each second cavity 32 has a lateral inlet hole 90 and a lateral outlethole 92, which are of a through type and are set, respectively, on thefirst portion 43 a and on the second portion 43 b of the second toplateral surface 42 so as to be aligned in a direction perpendicular tothe dimension of vibration D and to the corresponding vertical axis H.

In particular, considering a column of positioning sites 20, all thelateral inlet holes 90 and outlet holes 92 are aligned with one another.Furthermore, the respective optical source 80 and the respective opticaldetector 82 are set in such a way that, when all the miniaturized pieces22 have been moved away from the second cavities 32 that had housed thempreviously, the optical beam OB emitted by the optical source 80traverses all the lateral inlet holes and outlet holes 90, 92 and isreceived by the optical detector 82. In practice, the optical source 80and the optical detector 82 are coupled by an optical path, which isinterrupted in the case where there is at least one miniaturized piece22 set within a corresponding second cavity 32. In particular, theoptical path is obstructed in the case where this miniaturized piece 22penetrates into this second cavity 32 for more than a minimum length,measured in a direction parallel to the dimension of vibration D. Inthis case, the optical beam OB is not received by the optical detector82.

The optical detector 82 is hence able to generate an electrical signalindicating alternatively either recession of all the miniaturized pieces22 from the second cavities 32 of the positioning sites 20 of the columnconsidered or else residual presence of at least one miniaturized piece22 within a corresponding second cavity 32. This electrical signal canhence be used for controlling, for example, the pick-and-place machinein order to recover the miniaturized pieces 22, once the electrical testis completed.

Advantages that the present positioning device affords emerge clearlyfrom the foregoing description. In particular, the present positioningdevice 1 enables positioning of miniaturized pieces 22 within testingaccommodations, in a way substantially irrespective of the precisionwith which the pick-and-place machine has positioned the miniaturizedpieces 22 themselves within the first cavities 30 of the positioningsites 20. At the limit, even the miniaturized pieces that have been setby the pick-and-place machine vertically with respect to thecorresponding first bottom surfaces 34 are subsequently set within thecorresponding second cavities 32. In fact, given any second cavity 32,the corresponding covering surface 44 is arranged in such a way that apossible piece set vertically within the first cavity 30, by impactingagainst the covering surface 44, drops, setting itself in such a waythat its own bottom main surface S_(b) lies in the plane of the firstand second bottom surfaces 34 and 38.

In particular, reaching of the testing positions by the miniaturizedpieces 22 and hence alignment thereof is obtained using a vibratorymechanism and mechanical lead-ins.

Finally, it is clear that modifications and variations may be made towhat has been described and illustrated herein, without therebydeparting from the sphere of protection of the claims.

For instance, instead of the bearings 10, other mechanical couplingmeans may be used. It is moreover possible for the socket board 4 andthe fixed frame 8 to be juxtaposed, without interposition of anybearing. In this case, a lubricating liquid may be set between thesocket board 4 and the fixed frame 8.

In regard to the first and second cavities 30 and 32 of each positioningsite 20, they may have different shapes from those described above.Furthermore, in addition to or instead of the holes 72, there may bepresent suction holes, arranged, for example, in the first and secondportions 43 a, 43 b of the second top lateral surface 42 of eachpositioning site 20.

In regard to the first and second actuators 50 and 52, they may be of atype different from what has been described. For instance, the first andsecond actuators 50 and 52 may be of an electromechanical type.

It is moreover possible for the pneumatic pumps 74 to be kept turned onduring execution of the test by the tester 2.

In addition, removal of the miniaturized pieces 22 from the secondcavities 32, once the test is completed, may be performed by means of amechanism different from the one that has been described, such as, forexample, a mechanism designed to exert impulsive forces of impact,instead of pneumatic forces, on the miniaturized pieces 22.

Finally, embodiments are possible in which the second cavity 32 is sizedso as to receive the miniaturized piece 22 with a limited play. In thiscase, the width of the second bottom surface 38 exceeds the width of thebottom main surface S_(b) of the miniaturized piece 22 for not more thanapproximately 1/20 of the width of the bottom main surface S_(b) of theminiaturized piece 22.

From the foregoing it will be appreciated that, although specificembodiments have been described herein for purposes of illustration,various modifications may be made without deviating from the spirit andscope of the disclosure. Furthermore, where an alternative is disclosedfor a particular embodiment, this alternative may also apply to otherembodiments even if not specifically stated.

The invention claimed is:
 1. A device for positioning and testing aplurality of integrated circuit chips, comprising: a plurality ofholders, each of the plurality of holders comprising: a first receptacleconfigured to receive one of the plurality of integrated circuit chipsin a first direction from an external source, each of the plurality ofintegrated circuit chips having a conductive signal pad; and a secondreceptacle configured to receive the one of the plurality of integratedcircuit chips in a second direction that is substantially orthogonal tothe first direction, wherein the second receptacle has a conductivesignal terminal; and a positioner configured to move the one of theplurality of integrated circuit chips from the first receptacle, alongthe second direction, into the second receptacle to a position where theconductive signal pad is in electrical contact with the conductivesignal terminal.
 2. The device of claim 1, wherein the first receptacleis larger than the one of the plurality of integrated circuit chips andthe second receptacle is smaller than the first receptacle.
 3. Thedevice of claim 1, wherein the plurality of holders is movable togetherback and forth in at least one direction.
 4. The device of claim 1,wherein the first receptacle includes: a bottom; and a side wall havinga first portion that extends from and is substantially perpendicular tothe bottom, and a second portion that extends from the first portion andtapers outward, wherein the second portion is configured to guide theone of the plurality of integrated circuit chips into the first portionusing gravity.
 5. The device of claim 1, wherein each of the pluralityof holders includes a cover disposed over the second receptacle.
 6. Thedevice of claim 1, wherein each of the plurality of holders includes aremovable cover disposed over the second receptacle.
 7. The device ofclaim 1, wherein the second receptacle includes an end wall having anopening; and the positioner is configured to generate, within the secondreceptacle via the opening, a pressure that is different from a pressureoutside of the second receptacle.
 8. The device of claim 1, wherein thesecond receptacle includes an end wall having an opening; and thepositioner is configured to generate, within the second receptacle viathe opening, a vacuum that holds the one of the plurality of integratedcircuit chips in a position in which the conductive signal pad contactsthe conductive signal terminal.
 9. The device of claim 1, wherein thesecond receptacle includes an end wall having an opening; and thepositioner is configured to generate, within the second receptacle viathe opening, a pressure sufficient to eject the one of the plurality ofintegrated circuit chips from the second receptacle into the firstreceptacle along a direction opposite to the second direction.
 10. Thedevice of claim 1, wherein the holder includes a sensor configured toindicate whether the one of the plurality of integrated circuit chips ispositioned within the second receptacle such that the conductive signalpad contacts the conductive signal terminal.
 11. The device of claim 1,wherein the positioner is configured to move the one of the plurality ofintegrated circuit chips from the first receptacle into the secondreceptacle by moving the plurality of holders back and forth.
 12. Thedevice of claim 1, wherein the plurality of holders are arranged in arectangular array having a fixed numbers of rows and columns.
 13. Thedevice of claim 12, wherein the plurality of holders are supported bylinear bearings for enabling the back and forth movement.
 14. The deviceof claim 1, further comprising a tester for coupled to the conductivesignal terminal and configured to test the one of the plurality ofintegrated circuit chips in the second receptacle.
 15. A positioningdevice, comprising: a socket board including a socket, the socketforming a plurality of positioning sites, wherein each of the pluralityof positioning sites includes: a first receptacle configured to receivean electronic device in a first direction from an external source, theelectronic device having a conductive signal pad; and a secondreceptacle configured to receive the electronic device in a seconddirection that is substantially orthogonal to the first direction,wherein the second receptacle has a conductive signal terminal; and apositioner configured to move the electronic device from the firstreceptacle, along the second direction, into the second receptacle to aposition where the conductive signal pad is in electrical contact withthe conductive signal terminal.
 16. The positioning device of claim 15,further comprising a fixed frame on which the socket board is slidablymounted.
 17. The positioning device of claim 16, further comprising aplurality of bearings fixed onto the fixed frame and supporting thesocket board such that the socket board is constrained to moveback-and-forth in one direction.
 18. The positioning device of claim 15,wherein the socket is an array of columns and rows for holding theplurality of positioning sites.
 19. The positioning device of claim 15,wherein the second receptacle includes an end wall having an opening;and the positioner is configured to generate, within the secondreceptacle via the opening, a vacuum that holds the electronic device ina position in which the conductive signal pad contacts the conductivesignal terminal.
 20. The positioning device of claim 15, wherein thefirst receptacle is larger than the electronic device and the secondreceptacle is smaller than the first receptacle.
 21. The positioningdevice of claim 15, further including a cover disposed over the secondreceptacle.
 22. The positioning device of claim 15, further including aremovable cover disposed over the second receptacle.
 23. The positioningdevice of claim 15, further comprising a tester for coupled to theconductive signal terminal and configured to test the electronic devicein the second receptacle.
 24. The positioning device of claim 15,further comprising a sensor configured to indicate whether theelectronic device is positioned within the second receptacle with theconductive signal pad in contact with the conductive signal terminal.25. The positioning device of claim 15, wherein the second receptacleincludes an end wall having an opening; and the positioner is configuredto generate, within the second receptacle via the opening, a pressuresufficient to eject the electronic device from the second receptacleinto the first receptacle.
 26. The device of claim 1, wherein each ofthe plurality of holders further comprising a bottom, wherein the firstreceptacle and the second receptacle share the bottom.
 27. Thepositioning device of claim 15, wherein each of the plurality ofpositioning sites includes a bottom, wherein the first receptacle andthe second receptacle share the bottom.
 28. A device for positioning andtesting a plurality of integrated circuit chips, the device comprising:a plurality of holders, each of the plurality of holders comprising: afirst receptacle configured to receive one of the plurality ofintegrated circuit chips in a vertical direction from an externalsource, each of the plurality of integrated circuit chips having aconductive signal pad; and a second receptacle configured to receive theone of the plurality of integrated circuit chips in a horizontaldirection, wherein the second receptacle has a conductive signalterminal; and a positioner configured to move the one of the pluralityof integrated circuit chips from the first receptacle, along thehorizontal direction, into the second receptacle to a position where theconductive signal pad is in electrical contact with the conductivesignal terminal.
 29. The device of claim 28, wherein the firstreceptacle is larger than the one of the plurality of integrated circuitchips and the second receptacle is smaller than the first receptacle.30. The device of claim 28, wherein the plurality of holders is movabletogether back and forth in at least one direction.
 31. The device ofclaim 28, wherein the first receptacle includes: a receptacle bottom;and a side wall having a first portion that extends from and issubstantially perpendicular to the receptacle bottom, and a secondportion that extends from the first portion and tapers outward, whereinthe second portion is configured to guide the one of the plurality ofintegrated circuit chips into the first portion using gravity.
 32. Thedevice of claim 28, wherein each of the plurality of holders includes acover disposed over the second receptacle.
 33. The device of claim 28,wherein each of the plurality of holders includes a removable coverdisposed over the second receptacle.
 34. The device of claim 28, whereinthe second receptacle includes an end wall having an opening; and thepositioner is configured to generate, within the second receptacle viathe opening, a pressure that is different from a pressure outside of thesecond receptacle.
 35. The device of claim 28, wherein the secondreceptacle includes an end wall having an opening; and the positioner isconfigured to generate, within the second receptacle via the opening, avacuum that holds the one of the plurality of integrated circuit chipsin a position in which the conductive signal pad contacts the conductivesignal terminal.
 36. The device of claim 28, wherein the secondreceptacle includes an end wall having an opening; and the positioner isconfigured to generate, within the second receptacle via the opening, apressure sufficient to eject the one of the plurality of integratedcircuit chips from the second receptacle into the first receptacle alonga direction opposite to the horizontal direction.
 37. The device ofclaim 28, wherein the holder includes a sensor configured to indicatewhether the one of the plurality of integrated circuit chips ispositioned within the second receptacle such that the conductive signalpad contacts the conductive signal terminal.
 38. The device of claim 28,wherein the positioner is configured to move the one of the plurality ofintegrated circuit chips from the first receptacle into the secondreceptacle by moving the plurality of holders back and forth.
 39. Thedevice of claim 28, wherein the plurality of holders is arranged in arectangular array having a fixed numbers of rows and columns.
 40. Thedevice of claim 39, wherein the plurality of holders are supported bylinear bearings for enabling the back and forth movement.
 41. The deviceof claim 28, further comprising a tester for coupled to the conductivesignal terminal and configured to test the one of the plurality ofintegrated circuit chips in the second receptacle.
 42. The device ofclaim 28, wherein the one of the plurality of integrated circuit chipsmoves from the first receptacle into the second receptacle along acommon bottom surface of the first receptacle and the second receptaclewhich defines the horizontal direction.